Established 1982

Heat Sink

Aluminum Profiles

Description

Non-ferrous heat sinks are essential thermal management components used in electronic devices and systems to dissipate heat generated by electronic components, ensuring optimal performance and reliability. Crafted from high-conductivity non-ferrous metals such as aluminum and copper, these heat sinks offer efficient heat transfer, lightweight construction, and corrosion resistance, making them ideal for a wide range of electronic applications.

 

Our non-ferrous heat sinks are meticulously engineered to meet the demanding thermal requirements of modern electronic devices. They are available in various configurations, including finned, extruded, stamped, and bonded designs, to accommodate different heat dissipation needs and spatial constraints. Whether it’s for computer CPUs, LED lighting systems, power electronics, or automotive components, our heat sinks provide effective thermal management solutions to prevent overheating and prolong device lifespan.

 

With advanced manufacturing processes and precision machining techniques, our non-ferrous heat sinks offer superior thermal performance, durability, and reliability. They are designed to maximize surface area for efficient heat dissipation while minimizing weight and space requirements, ensuring compatibility with compact and high-density electronic designs.

Technique Data

Property Specification
Material Aluminum, copper, aluminum alloys, copper alloys, etc.
Construction Fins, extrusions, stamped, bonded, etc.
Thermal Conductivity High thermal conductivity for efficient heat transfer
Surface Area Optimized surface area for enhanced heat dissipation
Fin Density Customizable fin density for specific thermal requirements
Surface Finish Anodized, plated, or bare surfaces for optimal heat transfer
Weight Lightweight construction for minimal impact on device weight
Corrosion Resistance Excellent resistance to corrosion and oxidation
Compatibility Compatible with various electronic devices and systems
Customization Tailored designs and configurations to meet specific application needs
Applications Computer CPUs, LED lighting systems, power electronics, automotive components, telecommunications equipment, etc.

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Established 1982